I am making small D2 die plates .150 thick with a .501 +.0002 -.0000 hole in the center. I believe this will be used to stamp out .050 thick plastic most likely with a .500 +.0000 -.0002 punch ( thats the clearance and tolerance our brilliant engineers always come up with )
My plan is to bore the holes undersize and make a lap to bring the hole to size.
1. How much material should I leave for lapping?
2. What size and material should I make the lap? (I am making 12 pc. will I need more than one ? )
3. Any recommendations on the spindle speed or "feed" techniques?
4. What grit lapping compound should I use?
5. Should I finish the hole lapping before finish grinding thickness?
I never lapped before so any input would be appreciated.
My plan is to bore the holes undersize and make a lap to bring the hole to size.
1. How much material should I leave for lapping?
2. What size and material should I make the lap? (I am making 12 pc. will I need more than one ? )
3. Any recommendations on the spindle speed or "feed" techniques?
4. What grit lapping compound should I use?
5. Should I finish the hole lapping before finish grinding thickness?
I never lapped before so any input would be appreciated.