I'm guessing your application is a mold cavity for semiconductor encapsulation transfer molding? I've done many of those in the past, and have found that probably the simplest way is to write an inverted orbit routine which will finish the bottom at the rougher finish, and successively reduce power as the electrode orbits upward and outward. This will also be more cosmetically appealing since the finish will get smoother as it transitions from the floor to the side wall, without leaving an obvious "step" from rough to fine finish.